Ultra-high Resolution, Non-destructive 3D Imaging


  • Introduction

    Synchrotron-like 3D Imaging in a Laboratory System

    The UltraXRM-L200 is the only lab based ultra-high resolution CT scanner for 3D visualization of microscopic sample volumes. Xradia's precision X-ray focusing optics deliver a resolution as fine as 50 nm, seamlessly extending the capabilities of X-ray CT beyond those of conventional scanners. Integrated Zernike phase contrast imaging enhances the visibility of all edges and interfaces when absorption contrast is low. The UltraXRM-L200 delivers reliable 3D volumetric information otherwise only accessible by cross-sectioning or other destructive methods.

  • Highlights

    The revolutionary UltraXRM-L200 combines a high-flux laboratory X-ray source with proprietary X-ray optics into a lab based ultra-high resolution CT scanner. The non-destructive imaging with X-rays provides detailed 3D images of internal structures without the need for cutting or sectioning. With a resolution as fine as 50 nm, the UltraXRM-L200 provides insight into microscopic structures and processes previously not accessible with conventional X-ray technology. Operating with 8 keV X-rays, the UltraXRM-L200 enables observation of structures and materials in their natural state. Xradia's integrated phase contrast technology employing the Zernike method enhances the visibility of grain boundaries and material interfaces when absorption contrast is low.

  • Benefits
    • Non-destructive 3D X-ray imaging allows repeated imaging of the same sample under different conditions
    • Large working distance and atmospheric sample environment allows in-situ studies
    • Automated image alignment for tomographic reconstruction
    • Switchable field-of-view ranging from 15 to 60 µm
    • Absorption and Zernike phase contrast imaging modes
  • Applications

    Life Science Research
    The UltraXRM-L200 offers the ability to visualize the internal structure of biological specimens, such as bone, soft tissue, and biomedical devices with resolution down to 50 nm.

    Semiconductor Package Failure Analysis
    The UltraXRM-L200 offers visualization of semiconductor samples and wafer-level packaging, such as integrated circuits and through-silicon vias, for defect investigation and failure analysis without the need for physical cross-sectioning.

    Advanced Material Development
    Characterization capabilities for 3D structures of composite materials, such as paper, foams, and fuel cells.Material of different densities may be segmented through the use of absorption-contrast imaging.

    Oil & Gas Drilling Feasibility Studies
    Pore and flow modeling on the nano scale; complementary to imaging with the VersaXRM, extending the imaging resolution below 1µm.

  • Downloads

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